AeroVironment Introduces Next-Generation All-Electric VAPOR 55 MX Helicopter Unmanned Aircraft System
September 14, 2022 | Business WireEstimated reading time: 1 minute

AeroVironment, Inc., a global leader in intelligent, multi-domain robotic systems, announced the launch of the next-generation VAPOR® Helicopter unmanned aircraft system (UAS), VAPOR 55 MX. Delivering new levels of operational performance with a completely redesigned modular autonomy framework, VAPOR 55 MX enables increased endurance and expanded payload capacity to meet current and emerging needs of defense, commercial and industrial customers.
“The new VAPOR 55 MX is an easy-to-maintain system that incorporates a highly versatile modular architecture and tool-free rail system for simple, efficient integration of third-party or custom payloads, allowing users to adapt to multi-sensor, multi-mission requirements including utility inspection, aerial surveying, public safety and defense applications,” said Trace Stevenson, AeroVironment vice president and product line general manager for small UAS.
Built on the class-leading endurance and payload weight performance of its predecessor, VAPOR 55 MX features a new sleek and efficient low-profile design that enables the helicopter UAS to stay in the air 25 percent longer and operate in all weather. VAPOR 55 MX is heavy-lift capable and its increased usable payload capacity allows users to choose from single or multiple payload configurations.
This expansive modular payload bay can carry up to 12 pounds of payload with more than 70 minutes of flight endurance while still maintaining the 55-pound gross take-off weight (GTOW) restricted by the Federal Aviation Administration (FAA) for commercial customers. For military customers that require more take-off weight, VAPOR 55 MX is capable of a 65-pound GTOW and can carry up to 22 pounds of usable payloads with a reduced endurance trade-off, nearing the edge of Group 3 weight class.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.