CAES’ Quad-Core LEON4FT Processor Selected for European Next-Gen Star SensorsSeptember 20, 2022 | Business Wire
Estimated reading time: 1 minute
CAES, a leader in advanced mission-critical electronics for aerospace and defense, is pleased to announce that it has signed a multi-year contract with Jena-Optronik to deliver flight grade GR740 quad-core LEON4FT SPARC V8 Microprocessor devices for its next-generation sensor products.
The official contract signing will take place in person at the International Astronautical Congress (IAC), in the Swedish pavilion on September 20, 2022, in Paris, France. The CEO of Jena-Optronik, Peter Kapell and CAES Gaisler Product’s General Manager, Sandi Habinc will be in attendance.
“CAES has a long line of proven LEON technology with a legacy of robustness for use in various space applications like LiDAR and star sensors so we are excited to sign this contract with Jena-Optronik and continue our heritage,” said Mike Elias, Vice President and General Manager, CAES Space Division. “In addition to delivering flight proven technology, CAES is known for its expert technical support which sets it apart in the aerospace industry.”
The CAES GR740 microprocessor was chosen for its software reuse, lower power, and increased processing power. The standard interfaces, scalable performance and ease of design enable the addition of even more capability to future missions while maintaining the same basic infrastructure for other designs/products.
Jena-Optronik, based in Thuringia, Germany, is a worldwide leader in the development and manufacturing of opto-electronic sensors for the Attitude and Orbit Control Systems (AOCS) of satellites and spacecraft. Jena-Optronik’s current generation of star sensors as well as LiDAR sensors utilize CAES’s GR712RC, a dual-core LEON3FT SPARC V8 microprocessor.
“Given our very good experience with the prior generation LEONFT Processors, Jena-Optronik is looking forward to the next generation GR740, which will enable more computing power while meeting the required lower power for future Jena-Optronik sensor products in the coming years,” said Peter Kapell, CEO, Jena-Optronik. “We appreciate CAES as a key partner in our success in meeting more demanding future mission requirements.”
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.