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Are You Ready to Thrive? Keep an Open Mind

07/24/2024 | I-Connect007 Editorial Team
Anaya Vardya joined American Standard Circuits in 2007, and his leadership strategy has focused on teamwork, technological advancement, and a strong marketing strategy. He leans on his extensive industry background and is inspired by former Intel CEO Andrew Grove, whose philosophy centered on proactive adaptability and emphasized thriving over mere survival.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

07/24/2024 | ASMPT
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

BAE Systems to Deliver Advanced Microelectronics to U.S. Defense Industrial Base

07/23/2024 | BUSINESS WIRE
The contract will support the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project and will be managed by National Security Technology Accelerator (NSTXL).

DIS: Thriving With New Processes and Technologies

07/23/2024 | Barry Matties, I-Connect007
What does it take to really thrive in today’s business environment? Will it require big changes, or can you make small, incremental improvements? Jesse Ziomek, global sales director and product manager at DIS, Inc., a company that designs and manufactures automation equipment, focuses on strategies for thriving in the PCB industry by emphasizing cost reduction through smart robotic solutions and addressing bottlenecks to optimize yields.
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