IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
October 12, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
Opening day speakers included keynotes from Tech Search’s Jan Vardaman, and Intel’s Tom Rucker. Additional speakers throughout the day represented DoD, NIST, the European Union, Western Digital, IBM, AMD, Northrup Grumman, and BAE Systems.
IPC organized this symposium so that executives, government, and industry leaders could meet in person and share insights. The discussion was intended to identify key business and technology issues with near- and longer-term solutions. The purpose was focused on opportunities and challenges for next-generation advanced packaging production. The top-down agenda covers public policy updates, commercial and defense electronics technology drivers, current business environment for IC-substrates and component assembly and test manufacturing.
Figure 1: John Mitchell, president and CEO of IPC, addresses the crowd during a morning session at the IPC Advanced Packaging Symposium.
Vardaman laid the market groundwork in an early presentation Tuesday, pointing out that there is effectively no packaging capability in North America, forcing all semiconductors to be packaged in Asia; a theme that many of the speakers would return to throughout the day. Likewise, Vardaman pointed out the lack of substrate capabilities outside of Asia, setting up another capability gap that was addressed by nearly every speaker throughout the day: Investment in advanced packaging techniques is a critical manufacturing capability not only for U.S. and EU military needs, but also for supply chain resilience.
The CHIPS Act was a key area of discussion. During his presentation, Frank Gayle of NIST asserted that packaging and PCB manufacturing investment programs would be considered as appropriate to submit under the CHIPS Act. This seemed to be news to several attendees I spoke with, and if true, certainly leaves the door open for wider CHIPS Act investment throughout the supply chain.
Each speaker, in their own way, made the argument that the U.S. and EU need to ramp up these capabilities. During her Q&A session, Kim Eilert of BAE Systems was asked when BAE would need to have this capability available to them. Her answer was, “Today.” It was clear that she meant that quite literally.
Wednesday’s agenda includes a welcome from IPC Chief Technologist Matt Kelly, who will also moderate a panel discussion on the North American perspective on the IC substrate market. Other speakers will provide insights on the history of the package substrate industry, how the U.S. can gain a foothold in this market, where the technologies are at, and next steps.
Suggested Items
The Government Circuit: Support for Defense Spending Takes Top Priority
10/15/2024 | Chris Mitchell -- Column: The Government CircuitFor those of us living in the world of politics and policy, the final few weeks before a major election are a little nerve-wracking. Who is going to win? How might the candidates’ campaign promises affect our industry and our strategies over the next few years? One thing I do know: No matter who wins the White House and control of Congress on Nov. 5, IPC will continue working with members of both major parties to advance policies that boost innovation, investment, and growth and ensure the electronics manufacturing industry’s long-term success. We must.
Thinking Out of the Box: Pacific Northwest EMS Manufacturer Employs Successful Strategies With IPC
10/15/2024 | Michelle Te, IPC CommunityAllison and Chad Budvarson started Out of the Box Manufacturing, an EMS company in Renton, Washington, just one month after they were married in 2008. To stay competitive, they’ve utilized IPC’s workforce subscription and apprenticeship programs to train and maintain their staff. "Our relationship with IPC has evolved over the past several years," Allison says. "Initially, we saw IPC for its standards. But when I started attending the EMS Leadership Summit at APEX EXPO, I realized there was so much more to IPC, which opened more doors for us, creating growth and partnership opportunities I didn't realize were possible. For one, I like having frank conversations with EMS owners from other areas of the country, and I’m not worried they will steal my 'secret sauce.'"
Fall 2024 Issue of IPC Community Now Available
10/14/2024 | IPC Community Editorial TeamThere’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
Discover TRI's Solutions at Manufacturing Indonesia 2024
10/14/2024 | TRIPT Hibex Indonesia, the distributor of Test Research, Inc. (TRI), will take part in Indonesia's Leading Manufacturing, Machinery, Equipment, Materials, and Services Event, Manufacturing Indonesia 2024.
Nortech Systems Announces Expansion of PCBA Capabilities with IPC-J-STD-001 Space Addendum
10/08/2024 | BUSINESS WIRENortech Systems Incorporated (“Nortech Systems”, or the “Company), a leading provider of engineering and manufacturing solutions for the aerospace and defense industry, has announced the Company has certified trainers and operators to build printed circuit board assemblies (PCBAs) to the IPC-J-STD-001 Space Addendum standard.