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I-Connect007 Editor's Choice: Five Must-Reads for the Week

09/06/2024 | Nolan Johnson, I-Connect007
This week’s Top 5 starts with steps you can take to cultivate a culture of thriving. We also have bullish news from the global semiconductor sector, advice on how to tease out hidden cost drivers during the PCB design cycle, how the Altium-Ansys collaboration will affect design, and Happy Holden’s version of Occam’s Razor—three simple tools to keep your wet processes in line.

Hidden Cost Drivers in PCB Design

09/05/2024 | Cherie Litson, CID+, Litson1 Consulting
I recently taught a CID+ course, and if you’ve ever taken a CID or CID+ course, you know that we discuss cost adders quite a bit. When I asked the class of 15 design engineers their ideas on the biggest cost adders, the first and strongest response: the project manager. Are you surprised by their answer? After over 40 years in the industry, I wasn’t. If you step back and look at the process of product development, you’ll see that many decisions that affect costs down the line really do take root with the project manager.

Calling All California Employers: Harness State Funding for Workforce Training with IPC and ETP

09/05/2024 | IPC
IPC, a global industry association dedicated to its member companies' competitive excellence and financial success, announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program.

Intel, IBM Deliver Enterprise AI in the Cloud

09/03/2024 | Intel
IBM and Intel announced a global collaboration to deploy Intel® Gaudi® 3 AI accelerators as a service on IBM Cloud. This offering, which is expected to be available in early 2025, aims to help more cost-effectively scale enterprise AI and drive innovation underpinned with security and resiliency.

Quiet Power: An Evolution in PCB Design Costs

09/04/2024 | Istvan Novak -- Column: Quiet Power
In this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.
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