Continental Integrates Ambarella’s Scalable System-on-Chip Family in Advanced Driver Assistance Systems
November 21, 2022 | Business WireEstimated reading time: 2 minutes
In the future, Continental will offer Advanced Driver Assistance Systems (ADAS) solutions based on the “CV3” artificial intelligence (AI) system-on-chip (SoC) family from semiconductor company Ambarella. The high-performance, power-efficient and scalable SoC portfolio, which is built for ADAS applications, complements Continental’s solutions for assisted driving and further advances vehicle automation. The more sensors that are installed in a vehicle, the greater the amount of data collected to detect the environment. The joint solution with centralized single-chip processing based on 5-nanometer technology enables the next generation of vehicles to process the environmental perception of multiple sensors even faster, thanks to the increased performance level. Sensor solutions include high-resolution cameras, radars, lidars as well as ultrasonic sensors. The integrated SoC enables early data fusion, in which the information from different sensors is processed simultaneously for various applications such as emergency brake assist, parking or cruising.
“After exchanges on different use cases with Ambarella for two years, Continental is now integrating its high-performance, low latency, and low-power processing chipset into our assisted driving solutions. This brings our ADAS systems to the next level and helps to serve the growing amount of sensor data in the vehicle. With this, we achieve a more comprehensive and accurate environmental perception,” said Frank Petznick, Head of the Autonomous Mobility Business Area at Continental. “We have now combined our expertise in this field to offer an enhanced level of systems performance as well as the scalable solutions required by the market.”
Significant impact for industry and degree of vehicle automation
Continental's driver assistance systems enhanced with Ambarella's SoCs can process more collected data faster. In this way, they increase precision and enable a larger range of functions. The high scalability of the system-on-chip family allows vehicle manufacturers to choose the necessary performance level for their system requirements using the same vehicle architecture.
Despite the higher performance and accuracy, the solution consumes less power. This also leads to fewer cooling efforts, making sustainable energy savings possible, while also reducing system costs. As an added value to vehicle manufacturers, they can reduce their engineering investments across all vehicle types.
Unique system-on-chip performance with low power consumption
Ambarella’s fully scalable, power-efficient family of system-on-chips provides significant AI performance per watt for neural network computation, with a performance increase of over 40 times compared to its former semiconductor chip family. Additionally, Ambarella integrates its image signal processor technology into all SoCs. This results in robust ADAS systems with higher levels of environmental perception in challenging lighting, weather and driving conditions for both machine and human vision. Humans see through the sensors of the assistance system.
Continental’s ADAS systems with the integrated system-on-chip will be showcased for the first time at CES 2023 in Las Vegas.
Suggested Items
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency
04/23/2024 | Lockheed MartinThe Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.