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December 2022 Issue of SMT007 Magazine Available Now
December 1, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

In this issue of SMT007 Magazine, we bring you preview information for IPC APEX EXPO 2023. In the spirit of helping to plan your time at this event, consider this issue your roadmap for success before you even cross the threshold onto the show floor at the San Diego Convention Center.
December certainly seems to be driven by tradition. And while traditions often get a bad reputation as stodgy and tired, not all of them are so bad. For example, December is our traditional time to prepare for IPC APEX EXPO. This year, the conference and trade show will take place January 21–26, 2023 and as we publish this magazine, the show floor boasts 366 exhibitors.
Turn to this issue for a handy reference. You will find the event schedule, details on special sessions you won’t want to miss, how to use the APEX app on your smartphone, show floor highlights, the skinny on social/networking events, hints of new awards for member contributions, information on professional development courses, and new offerings such as the E-Textiles track and the India Pavilion. There is so much more packed into this year’s SMT007 Magazine show preview issue, you don’t want to miss any of it.
Download your copy today on the virtual newsstand or sign up for delivery in your e-mailbox by subscribing here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.