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Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging

09/15/2025 | Michael Carano -- Column: Trouble in Your Tank
Direct metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.

Closing the Loop on PCB Etching Waste

09/09/2025 | Shawn Stone, IEC
As the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.

Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs

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In PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.

Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs

08/27/2025 | Michael Carano -- Column: Trouble in Your Tank
To quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons. 

The Government Circuit: Navigating New Trade Headwinds and New Partnerships

08/25/2025 | Chris Mitchell -- Column: The Government Circuit
As global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance. 
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