Printed Circuit Boards Have Champions on Capitol HillFebruary 14, 2023 | Nolan Johnson, I-Connect007
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House Resolution 7677 from the 2021/22 Congressional session may have run out of time before the election cycle, but that hasn’t ended the effort to help fund the printed circuit board industry alongside the semiconductor industry.
IPC vice president of global government relations, Chris Mitchell, shared this letter, sent to DOD on Wednesday by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), which insists DOD must “leverage all available resources, including the use of Title III of the Defense Production Act (DPA), to increase domestic production of PCBs and IC substrates.”
“U.S. investments in semiconductor manufacturing will not provide greater security and resiliency without complementary initiatives to bolster the printed circuit board (PCB) and integrated circuit (IC) substrate-manufacturing base,” they stated in their letter.
“Thanks to Reps. Anna Eshoo and Blake Moore for urging DoD to leverage the Defense Production Act and other programs to support a resurgence in U.S. production of printed circuit boards,” said Mitchell in response to this letter. He continued, “Rebuilding this base is important to U.S. defense needs and supply chain resiliency but also to achieving the goals laid out in the CHIPS and Science Act. Silicon drives changes across the electronics manufacturing industry, and thus investments in silicon must be paired with investments in other strategically important segments of the electronics industry, including printed circuit board fabrication and assembly.”
GlobalFoundries (GF) announced it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing09/22/2023 | GlobalFoundries
The U.S. Department of Defense (DoD) has awarded GlobalFoundries (Nasdaq: GFS) (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
APCT, a leading name in the PCB and electronics industry, is delighted to announce the appointment of Peter Austin as its President and CEO, effective September 1. Peter takes the reins from former CEO, Steve Robinson, who has retired after years of dedicated service to the company.
Ever since high density interconnect (HDI) was created in 1982 by Hewlett-Packard to package its first 32-bit computer powered by a single chip, it has continued to evolve and provide the solutions for miniaturized products. The leading edge of HDI technology became the process used for organic flip-chip packaging for the semiconductor industry. The two distinct markets—IC substrates and product-system integration—are now colliding and utilizing the same ultra-HDI manufacturing processes.
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes09/21/2023 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.