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STI Electronics Requalifies for Four IPC Qualified Manufacturers Listings

06/18/2024 | STI Electronics
IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001, IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listings (QML).

IPC Impact Day Recap With Rich Cappetto

06/18/2024 | I-Connect007 Editorial Team
IPC has hosted its annual IPC Impact Day in Washington, D.C., for at least the past decade, with the first event taking place in the 1990s. This popular and important advocacy tool allows an industry segment to meet their local congresspeople, educate them on important issues, and influence new or existing legislation to support their interests. We spoke with Rich Cappetto, senior director of North American government relations at IPC, about the importance of the event and what it means for the greater PCB industry. He also highlighted an important change: There will be several IPC Impact Days throughout the year to allow smaller groups of industry professionals to visit Washington more often with a more targeted message.

Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1

06/14/2024 | Pete Starkey, I-Connect007
Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles. 

IPC Masters 2024 Aims to Enhance Operator Skills in China

06/14/2024 | IPC
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.

IPC Hosts Advanced Packaging Symposium in Tokyo

06/13/2024 | IPC
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.
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