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BTU Showcases the Ultimate Flux Management Solution at the SMTA Texas Expos
March 22, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the following upcoming events where they will discuss Aqua Scrub™ flux management technology and PYRAMAX™ reflow ovens.
- SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano Event Center in Plano, TX
- SMTA Houston Expo & Tech Expo on Thursday, March, 30, 2023, at the Stafford Centre in Stafford, TX.
The Aqua Scrub flux management system is purpose-built as a stand-alone system that can be easily retrofitted on PYRAMAX reflow ovens in the field as well as optional on new PYRAMAX ovens from the factory. The next-generation solder reflow flux management system is designed to decrease operational cost by 4X compared to traditional condensation systems. Aqua Scrub’s patent-pending design uses an aqueous-based gas scrubbing technology compatible with most known paste and flux types.
“Our Aqua Scrub flux management system has been widely adopted in many high-volume production lines in the Southwest region,” said Isaiah Smith, regional sales manager for BTU. “Aqua Scrub is a truly novel system allowing efficient flux collection regardless of chemistry, and our system has been further optimized with a new more efficient rinse agent, and improved gas extraction,” added Smith.
BTU PYRAMAX reflow ovens provide optimized lead-free processing for the ultimate productivity and efficiency. BTU’s exclusive closed-loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10, and 12-zone air or nitrogen models, 350°C maximum temperature, and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.