I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 24, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

It’s almost as if upheaval is the new normal. We often describe slow-moving but unstoppable change as moving in “geologic time.” But occasionally–like an earthquake–geology shifts suddenly. Here in my office, tracking the news of the industry, things are moving faster than geologic time, but more slowly than the jolt of an earthquake. The wave seems almost surfable, where before it seemed overwhelming. In this week’s list, we bring news from five different, high-vibration areas in our industry. If you read nothing else this week, these five items will keep you informed.
The Big Picture: A New Globalization
Published March 20, 2023
I-Connect007 columnist, Mehul Davé takes a step back to consider nationalism, globalism and their teeter-totter relationship, the “paradox mindset” as a unifying worldview, the advent of AI, and the implications all these dynamics bring to the world in which we do business. No wonder this column got so much attention.
Darwin AI Evolving the Islands of Automation
Published March 20, 2023
Speaking of the effect of artificial intelligence applications on our industry, we recently had the opportunity to interview Darwin AI’s CEO and founder, Sheldon Fernandez. Darwin AI is focused on bringing AI to electronics assembly. Learn what he has to say here.
Foxconn Announces FY2022, 4Q22 Financial Results
Published March 20, 2023
As one of the largest electronics assembly companies on the planet, Foxconn’s 2022 revenues equal nearly $218 billion. How did the rest of the financial numbers turn out? Seems plenty of readers wanted to know.
NextFlex Launches $4.4M Funding Opportunity to Strengthen U.S. Electronics Manufacturing, Advance Adoption of Hybrid Electronics
Published March 22, 2023
From the press release, “NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, released Project Call 8.0 (PC 8.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing that support Department of Defense priorities. The total PC 8.0 project value is expected to exceed $9.4M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $134M.” If this is a program you can take advantage of, read on here.
The Summit View of the Marketplace
Published March 21, 2023
Investments, staffing, cybersecurity, and a peek into his crystal ball—John Vaughan, vice president of strategic markets at Summit Interconnect, sits down with Nolan Johnson to talk about it all. Business is good, by the way, thanks to Summit’s portfolio of military contracts, and he has sound advice to offer for smaller shops in the United States, and their real ability to make a difference in PCB fabrication.
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Brent Fischthal - Koh YoungSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.