Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Visit Dymax at SMTA International 2023 Discover Innovative Light-Cure Solutions for Today’s Electronics

09/21/2023 | Dymax
Dymax, a leading manufacturer of light-curing materials and equipment, will exhibit in booth 1526 at SMTA International 2023 in Minneapolis, MN, from October 10-11.

The Drive Toward UHDI and Substrates

09/20/2023 | I-Connect007 Editorial Team
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.

Rigid-flex Stackup: It’s a 3D World

09/20/2023 | Andy Shaughnessy, Design007
Z-zero founder Bill Hargin has been studying stackup design techniques for years. He developed the company’s PCB stackup planning software, and he wrote an I-Connect007 eBook, The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design. In this interview, Bill shares his thoughts on designing rigid-flex stackups, the challenges they bring, and what rigid board designers need to know about designing stackups in 3D. “Flexperts” Mark Finstad of Flexible Circuit Technologies and Nick Koop of TTM Technologies also offer insight into the many tradeoffs that rigid-flex designers face.

Nolan's Notes: Convergence

09/19/2023 | Nolan Johnson -- Column: Nolan's Notes
When I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping. As I look back on our coverage in the past five years, I see convergence taking place, moving like a glacier—slow and steady but with formidable force. In this issue of PCB007 Magazine, the three areas of convergence we consider are materials, advanced packaging, and UHDI.

Standard Of Excellence: The Products of the Future

09/19/2023 | Anaya Vardya -- Column: Standard of Excellence
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in