- 
                                
                        
                         - News
 -  Books
                        
Featured Books
- pcb007 Magazine
 Latest Issues
Current Issue
                                                                                                        The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
                                                                                                        Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
                                                                                                        Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
 - Columns
 - Links
 - Media kit
 ||| MENU - pcb007 Magazine
 
Stanton Rak: Patient Leaders Nurture Growth
March 31, 2023 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
Stanton Rak, principal at SF Rak Company, discusses his new IPC President's Award. He says a successful leader must demonstrate passion for what they do, and that working in an IPC leadership role requires a unique approach to collaboration. IPC’s diverse membership means leaders must cultivate patience and be open to relying on the expertise of their fellow professionals.
Stan, congratulations on receiving this award. This award is all about leadership, so perhaps you could talk about being a leader in IPC and why it’s important.
IPC provides an excellent opportunity for industry members to come together, build relationships, participate in networking activities, and enhance their professional careers. As a leader in IPC, one can directly influence the sustainability of the electronics manufacturing industry at large, as well as one’s company, career, and the careers of fellow colleagues. So, it’s very powerful being a leader in IPC; it essentially ensures the sustainability of the industry, yourself, and those around you.
What committees or subcommittees are you involved in?
From a leadership perspective, my main role is as the Technical Program Committee chair for the IPC APEX EXPO Technical Conference. I’ve been a member of this committee for eight years. For IPC APEX EXPO 2022, I was co-chair along with Bev Christian; this year, my co-chair is Udo Welzel of Bosch. We have a committee of 20 technical experts from industry who’ve helped us develop a three-day program. We’ll have 72 technical papers and 15 posters presented this year. There are 35 Professional Development Courses planned that were developed by IPC Training with some oversight from our committee. We also have two special sessions planned on hot topics—advanced packaging and e-mobility.
What do you feel enabled you to become a leader?
First, it’s important to have a passion for what you do. In my case, it was science and technology, as well as collaborating as a team to achieve a common goal. It’s also important to have decent organizational skills, the ability to listen to others, and to demonstrate that your work adds value. There are a few notable differences between being a leader in the corporate world vs. IPC. In the corporate world, I worked with technical experts and specialists from a very large organization comprised of 30 factories, in 16 different countries, with products being manufactured for 12 different business units. The challenge was how to standardize the electronic assembly materials throughout such a diverse organization. I had to balance preferences from the business units, plants, and regions of the world, as well as individuals. We formed cross-functional teams that worked across organizational lines and geographical regions to create a data-backed consensus for the standardization of our manufacturing materials.
To read this entire conversation, which appeared in the 2023 edition of Show & Tell Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.