Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
SEMI ESD Alliance 2023 CEO Outlook to Discuss Future of Chip Design, Semiconductor Industries
April 3, 2023 | SEMIEstimated reading time: Less than a minute
Semiconductor industry executives will gather May 18, 2023, in Santa Clara, California for CEO Outlook, an annual panel discussion about the current state and future of the chip design and semiconductor industries, the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced. The event is open to ESD Alliance and SEMI members at no cost. Registration is open.
The in-person event, co-sponsored by ESD Alliance member Keysight Technologies, will be held in building 5 at Agilent Technologies, 5301 Stevens Creek Blvd. in Santa Clara. The event begins at 5:30 p.m. with networking, food and beverages, followed by the hour-long panel at 6:30 p.m. and concluding with an audience Q&A session.
The ESD Alliance Annual Membership meeting begins at 5 p.m. Non-members registered for CEO Outlook are welcome to attend.
Semiconductor Engineering Editor-in-Chief Ed Sperling will moderate the panel discussion.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
IBM, Dallara to Advance AI and Quantum-Powered Design for High-Performance Vehicles
05/01/2026 | IBMIBM and the Dallara Group, a world-leading racing and high-performance vehicle manufacturer, announced a collaboration to advance vehicle design and optimization using AI and explore the use of quantum computing.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.