Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics, PE, Advanced Packaging
April 4, 2023 | SEMIEstimated reading time: 1 minute
The FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration. Hosted by SEMI, FLEX is now part of SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.
Themed Intelligently Flexible, FLEX Conference 2023 will attract global industry professionals from more than 150 companies, R&D labs, and government agencies as the event focuses on equipment, processes, materials and applications driving the latest FHE technology breakthroughs. FLEX will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX showcases advancements in next-generation electronics packaging accelerating industry growth,” said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. “Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters and product information.”
“FLEX is a leading forum for networking with colleagues passionate about flexible hybrid electronics,” said Robert Praino, Chief Innovation Officer and Co-Founder of Chasm Advanced Materials Inc. and chairman of the FLEX Executive Planning Committee. “We’ve combined compelling industry topics with abundant deep dives into areas of common interest for learning across the ecosystem. The FLEX executive committee has worked to ensure rich technical content, consistent with the event’s tradition over the past 20-plus years, that promises to shed new light on business and innovation opportunities ahead.”
Share on:
Suggested Items
Electronics Manufacturers Double Down on Sustainability Efforts Despite Challenges, According to New Report by IPC
03/18/2025 | IPCEvolve debuted today at IPC APEX EXPO as a comprehensive program designed to help electronics companies move sustainability forward on an accelerated path. IPC, the global electronics association, created Evolve in direct response to research showing an increased interest across the industry in sustainability efforts and product circularity.
European Defence Industry Faces Critical Need for Electronics Made in Europe, According to New Report by IPC
03/18/2025 | IPCEurope is becoming more reliant on electronics manufactured outside of Europe, potentially leading to vulnerabilities that impact regional security, according to a new report by IPC, the global electronics association together with DECISION Etudes & Conseil.
DuPont Announces CEO and Non-Executive Chair for the Planned Independent Electronics Company
03/17/2025 | DuPontDuPont announced Jon Kemp, President, DuPont Electronics & Industrial will be the Chief Executive Officer and a member of the board of directors for the future independent Electronics public company that will be created following its intended spin-off from DuPont.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/14/2025 | Nolan Johnson, I-Connect007Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
Vexos Enhances Global Manufacturing Footprint with New Electronics Manufacturing Facility in China
03/13/2025 | EINPresswire.comVexos, a leading global provider of Electronic Manufacturing Services (EMS) and Custom Material Solutions (CMS), is pleased to announce the successful relocation of its China operations to a newly opened, state-of-the-art manufacturing facility in Dongguan, China.