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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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FTG Announces Results of AGM
April 21, 2023 | Globe NewswireEstimated reading time: Less than a minute
Firan Technology Group Corporation announced the results of its annual general meeting of shareholders (AGM), held in Toronto, Ontario on April 19, 2023. The Corporation is pleased to report that each of the director nominees listed in its management information circular dated February 28, 2023, were elected as directors of FTG. The directors have been elected to serve until the close of the next annual meeting of shareholders.
There were 34 shareholders represented in person or by proxy at the AGM holding 13,275,294 Common Shares representing 55.52% of the Corporation’s issued and outstanding Common Shares.
In addition, at the AGM, the shareholders also re-appointed MNP LLP, Chartered Professional Accountants, as the Corporation’s auditor and authorized the directors to fix the auditor’s remuneration. The shareholders also approved resolutions confirming the amendment and restatement of By-Law No. 1 of the Corporation and confirming By-Law No. 2 of the Corporation.
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10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design
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Scanfil Continues to Succeed in Defending its Profit Margin in Challenging Market
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The Chemical Connection: Troubleshooting PCB Process Problems
10/29/2024 | Don Ball -- Column: The Chemical ConnectionAs a supplier of PCB wet processing equipment, we inevitably find ourselves involved in helping customers solve sudden process problems that may or may not be caused by equipment malfunctions. For the most part, equipment problems are relatively easy to identify and repair: sensors for chemistry and equipment control, clogged nozzles and filters, leaks in the plumbing, etc. But what happens when the equipment checks out and the problem is still there?