KLA, imec Announce MOU to Advance the Electrification of the Automotive Industry
May 16, 2023 | KLAEstimated reading time: 1 minute
KLA Corporation and imec announced the intention to establish the Semiconductor Talent and Automotive Research (STAR) initiative, focusing on developing the talent base and infrastructure necessary to accelerate advanced semiconductor applications for electrification and autonomous mobility and move the automotive industry forward. The initiative builds on over 25 years of collaboration between imec and KLA.
This initiative is designed to connect automotive, semiconductor and innovation research initiatives in Europe (Belgium), the United States (Michigan) and Asia (Japan). Each partner will bring relevant expertise to identify and manage programs aligned to the automotive industry, as well as talent development and recruitment.
The plan establishes a center of excellence (COE) in Michigan to formalize support for the development of the semiconductor industry workforce as well as the advancement of autonomous automotive solutions and electric vehicle research. Founding partners include General Motors, the University of Michigan, Washtenaw Community College and the Michigan Economic Development Corporation (MEDC). Specifically, the Michigan center intends to focus on:
- Accelerating fundamental and advanced research for vehicle electrification and autonomous automotive solutions
 - Developing and translating of innovations in vehicle electrification and autonomous automotive technologies
 - Collaborating with learning institutions, including K-12 and vocational schools, community colleges, four-year colleges and research universities, to enable a Midwest-based skilled talent pipeline
 - Training and re-training programs to prepare the current workforce for modern chip manufacturing and assembly roles
 - Creating a physical collaboration space, laboratory and training spaces, and incubator funding for related startups
 
Global footprint leveraging regional strengths
Michigan is recognized globally as a hub for industry and innovation with a robust manufacturing, research and education infrastructure, making it a natural choice for the STAR Initiative's North American research center location. In addition to KLA, imec and founding members, additional organizations are expected to join as the program matures.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.