Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Koh Young Technology Showcasing its Inspection Solutions at electronica and SEMICON Europa

10/15/2024 | Koh Young Technology
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024.

Ventec Promotes Bill Wang to Group Technical Vice President

10/14/2024 | Ventec
Ventec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President. 

DuPont Announces Two Technology Leaders as DuPont Laureates

10/11/2024 | PRNewswire
DuPont announced that two of its technology leaders have achieved the professional distinction of DuPont Laureate, the company's most distinguished technical designation.

The SD11 Inkjet Printer and Ventec Giga Solutions

10/10/2024 | Marcy LaRont, PCB007 Magazine
Ventec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.

Zhen Ding Technology Reports Record Revenue and Profitability in Q3 2024

10/09/2024 | Zhen Ding Technology
ZDT achieved consolidated revenue of NTD 58.2 billion in Q3 2024, reflecting an impressive 28.3% year-over-year growth. This record-breaking performance was driven by strong demand across all of the company’s business segments, particularly in high-density interconnect (HDI) and rigid-flex PCBs.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in