Intel, SAP Embark on Strategic Collaboration to Expand Cloud Capabilities
May 17, 2023 | IntelEstimated reading time: 2 minutes
Intel and SAP SE announced a strategic collaboration to deliver more powerful and sustainable SAP software landscapes in the cloud. Designed to help customers derive greater scalability, agility and consolidation of existing SAP software landscapes, the collaboration deepens Intel’s focus on delivering extremely powerful and secure instances for SAP, powered by 4th Gen Intel® Xeon® Scalable processors.
Using SAP Application Performance Standard benchmarks, Intel’s 4th Gen Xeon processors enable significantly higher performance numbers when compared to previous generations of Xeon processors, and these impressive results will be passed along to SAP customers around the globe. Additionally, Intel enables current virtual machine (VM) sizes up to 24TB with a goal to ramp up to VM sizes of 32TB with the RISE with SAP solution.
SAP customers with 4th Gen Xeon processors can enjoy faster processing speeds and improved performance with up to 38% CPU power savings1, while also benefiting from the scalability and flexibility of the cloud. The combination of these technologies aims to enable customers to deploy the RISE with SAP solution quickly and easily, while also helping to ensure the security and reliability that they need to run their businesses.
“Many of the world’s largest SAP S/4 HANA® systems run on Intel architecture,” said Christoph Schell, chief commercial officer at Intel. “The new cloud computing experience powered by 4th Gen Xeon will not only help SAP customers meet growing compliance and security requirements, it will also enable them to apply advanced technologies for faster, more secure, integrated business processes.”
Intel's 4th Gen Xeon processors have the most built-in accelerators of any CPU on the market. They improve performance and lower customer total cost of ownership (TCO)2 allows customers to optimize their enterprise resource planning for RISE with SAP. Significant improvements to system performance can result in fewer systems needed to meet customer requirements.
“By working with Intel and our joint infrastructure-as-a-service partners, we are able to bring the best of our respective technologies together to create a truly innovative and powerful cloud computing solution for our customers,” said Scott Russell, executive board member, Customer Success, SAP. “This effort is a testament to our commitment to delivering value to our customers through RISE with SAP, and we look forward to working closely with Intel to continue innovating in the cloud.”
Beyond the collaboration for larger instance types in the cloud, Intel and SAP will explore use cases to leverage confidential computing for SAP HANA® Cloud, SAP’s database-as-a-service offering, to serve future requirements around enhanced data security and encryption starting with Microsoft Azure confidential computing.
Suggested Items
Thinking Out of the Box: Pacific Northwest EMS Manufacturer Employs Successful Strategies With IPC
10/15/2024 | Michelle Te, IPC CommunityAllison and Chad Budvarson started Out of the Box Manufacturing, an EMS company in Renton, Washington, just one month after they were married in 2008. To stay competitive, they’ve utilized IPC’s workforce subscription and apprenticeship programs to train and maintain their staff. "Our relationship with IPC has evolved over the past several years," Allison says. "Initially, we saw IPC for its standards. But when I started attending the EMS Leadership Summit at APEX EXPO, I realized there was so much more to IPC, which opened more doors for us, creating growth and partnership opportunities I didn't realize were possible. For one, I like having frank conversations with EMS owners from other areas of the country, and I’m not worried they will steal my 'secret sauce.'"
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Jabil Introduces New High-Performance, Purpose-Built AMD and Intel Servers Optimized for AI, FinTech, and Cloud Applications
10/14/2024 | BUSINESS WIREJabil Inc. announced that it is expanding its server portfolio with the J421E-S and J422-S servers, powered by AMD 5th Generation EPYC™ and Intel® Xeon® 6 processors.
CACI Acquires Applied Insight
10/10/2024 | CACI International Inc.CACI International Inc announced that it has acquired Applied Insight, a Northern Virginia-based portfolio company of Acacia Group , in an all-cash transaction.
SolderKing Celebrates a Milestone of Growth and Innovation in Soldering Solutions
10/10/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.