-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Boris Berezovsky Joins Summit as VP of Finance and Accounting
May 24, 2023 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect announced that Boris Berezovksy has joined the company as Vice President of Finance and Accounting. With extensive experience domestically and internationally, Berezovsky brings a wealth of financial knowledge and analysis expertise to the company. In this new position, he will oversee the Accounting, FP&A, Customer Credit, Treasury, and Tax departments.
Mr. Berezovsky will report to Summit’s Chief Financial Officer, Tom Caldwell.
“Boris’ impressive profile includes a proven track record of managing and improving the financial performance of companies across various industries,” said Tom Caldwell, Chief Financial Officer for Summit Interconnect. “He has proven success identifying and meeting business needs and driving results. Boris’ analytical thinking, combined with a passion for leading change and solving problems, makes him an outstanding addition to Summit’s leadership team.”
With eight North American locations, Summit provides a total manufacturing solution for printed circuit boards used in high-growth defense, semiconductor, and commercial markets. Berezovsky’s addition further strengthens the company’s commitment to being the most reliable and flexible PCB manufacturing partner.
“Summit Interconnect is an established, well-respected industry leader with unmatched experience manufacturing all types of PCBs,“ stated Boris Berezovksy. “I am pleased to be a part of this outstanding team and look forward to supporting the company’s growth plans with a customer-centric financial approach.”
Prior to joining Summit, Berezovsky was the Director of Finance for Tower Semiconductor. While there, he made finance an integral part of every business and operational activity in Tower US. By implementing new work processes and procedures, including a central inventory management and control system, he successfully reduced inventory costs, improved response time, and enhanced customer satisfaction. He also successfully led and negotiated high-risk, large-scale financial projects related to M&A, external financing, lines of credit, and insurance claims.
Berezovsky holds a B.A. in Economics from the University of Haifa and is a Certified Public Accountant in Israel.
Suggested Items
KLA Completes First Phase of US$200 Million Singapore Operations Expansion
10/04/2024 | KLAKLA, a world leader in developing industry-leading equipment and services that advance innovation throughout the electronics industry, today celebrated the completion of Phase 1 of its newest manufacturing facility.
MIRTEC Celebrates 20 Year Milestone Anniversary
10/04/2024 | MIRTECMIRTEC Co., LTD, “The Global Leader in Inspection Technology,” proudly celebrates the 20th anniversary of its North American Sales and Service Division, MIRTEC Corp.
IPC Cyber Disaster Recovery Webinar: Essential Preparedness for Electronics Manufacturers
10/03/2024 | IPCIn today's fast-evolving electronics manufacturing landscape, where digital threats loom large, safeguarding operations requires more than just IT solutions—it demands full production line awareness.
Explore Advanced Coating Solutions for Electronics at SMTA International 2024
10/03/2024 | ECTEngineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.
IPC CEMAC 2024: Shaping Innovation and Driving Technological Transformation in Electronics Manufacturing
10/03/2024 | IPCIPC CEMAC(China Electronics Manufacturing Annual Conference, as an exclusive annual event for members in the electronics manufacturing industry, aims to promote industry development and cooperation, facilitate the application and promotion of quality and technical standards in China's electronics manufacturing, and establish an efficient, professional, and high-value international exchange platform centered around IPC international industry standards.