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Hofstetter PCB Group Purchases Mass-PCB Vacuum-Filling & Planarising System from Adeon Technologies for New Via Filing Subcontract Services

10/30/2025 | ADEON Technologies
During the Productronica Exhibition in Munich from November 18 through to 21, Adeon is announcing the sale of the newest 2025 model Via Filling equipment with Large Container System and the Planarising system from Mass-PCB to SMF-Hofstetter from Herrenberg, Germany.

Highlights at productronica 2025

10/29/2025 | productronica
Just a few more weeks to go before the anniversary edition of productronica. The world’s leading trade fair for the development and production of electronics celebrates its 50th anniversary this fall. From November 18 to 21, Munich will once again be the meeting place for the international electronics industry.

Unlocking the Promise of AI in Electronics Manufacturing

10/29/2025 | Shobhit Agrawal, Keysight Technologies
The electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.

Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production

10/28/2025 | Kurt Palmer -- Column: Driving Innovation
Rigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.

TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand

10/27/2025 | I-Connect007 Editorial Team
TSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
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