-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
American Standard Circuits Installs New Schmoll SpeedMaster HDI 6 from Burkle North America
September 11, 2023 | American Standard CircuitsEstimated reading time: 1 minute

American Standard Circuits has purchased and installed new Schmoll SpeedMaster HDI 6 high technology drilling equipment provided by Burkle North America.
Burkle North America President and CEO Kurt Palmer commented, “With the Speedmaster HDI 6, American Standard Circuits has acquired a state-of-the-art high speed drilling machine, with accuracy better than +/- 20µm. Equipped with linear motors in all three axes, the Speedmaster not only is fast and accurate, but maintenance costs are low as well. ASC also chose to include the 6,200 capacity “tool chain”, significantly reducing manual drill bit handling and further increasing productivity. Burkle and Schmoll are proud to be part of the American Standard Circuits team!”
President and CEO of American Standard Circuits Anaya Vardya noted, “With customer demand for our Ultra HDI technology growing, we had to choose the best equipment we could find and the SpeedMaster fit the bill. With precision drilling we are able to handle all of our HDI needs future drilling needs. This equipment is a game changer for us.”
Educational titles from American Standard Circuits:
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
-
Visit I-007eBooks.com to download these and other free titles.
Suggested Items
IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
06/03/2025 | IIT KharagpurIn a landmark move to foster global collaboration in semiconductor research and talent development, IIT Kharagpur has signed a Memorandum of Understanding (MoU) with the Institute of Microelectronics (IME) under Singapore’s Agency for Science, Technology and Research (A*STAR).
STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process
06/02/2025 | STARTEAM GLOBALSTARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
06/02/2025 | SEMIWith materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
CACI to Deliver Additional SIGINT and EW Technology for U.S. Army Soldiers with TLS BCT Manpack
06/02/2025 | CACI International Inc.CACI International Inc announced that a contract modification has been awarded by the U.S. Army to continue procurement, training, and fielding for the Terrestrial Layer System Brigade Combat Team Manpack (TLS BCT Manpack).
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.