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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
June 2, 2025 | SEMIEstimated reading time: 1 minute
With materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements. The event will be held on June 23-25, at Hayes Mansion in San Jose, California. Registration is open.
SMC is the industry’s premier event focused on drivers of advanced materials, highlighting key opportunities across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.
SMC 2025 Keynote Presentations
Accelerating AI Computing with Innovations from Materials to AI Factories
- John Hu, Director, Advanced Technology Group, NVIDIA
Semiconductor Industry – A Logic Technology Outlook
- Carlos H. Diaz, PhD, Senior Director, TSMC
Reinventing the Transistor for the Quantum Age
- Chetan Nayak, PhD, Technical Fellow, Microsoft
Integrated Material Development Modality Enabling the AI Revolution
- Surésh Rajaraman, PhD, Executive Vice President & Business Unit Head, Thin Films, EMD Electronics
Themed The New Era of Materials Innovation, SMC 2025 will feature the following key sessions:
- Market Geopolitical, and Economic Trends
- Materials in Next Generation Memory Devices
- Next Generation FETs
- Materials Innovation Enabled by AI
- Advanced Packaging, Materials Integration & Challenges
- Orbital Foundries for Next-Generation Semiconductors
- SEMI PFAS Update
- Executive Panel: Impact of US Policy on Semiconductor Industry
Presentations at SMC 2025 will feature insights from the following industry leaders:
- AMD
- Applied Materials
- ASML
- Axiom Space
- Ayar Labs
- Boston Consulting Group
- EMD Electronics
- Entegris
- imec
- Intel Corporation
- Lam Research
- Linx Consulting
- Meta
- Microsoft
- Mitsubishi Chemical Group
- Needham & Company
- NVIDIA
- SEMI
- Techcet
- Terecircuits
- TSMC
The event will feature two exclusive networking sessions, offering attendees the chance to reconnect with industry peers and build new relationships with professionals driving materials innovation.
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.