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Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
June 2, 2025 | SEMIEstimated reading time: 1 minute
With materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements. The event will be held on June 23-25, at Hayes Mansion in San Jose, California. Registration is open.
SMC is the industry’s premier event focused on drivers of advanced materials, highlighting key opportunities across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.
SMC 2025 Keynote Presentations
Accelerating AI Computing with Innovations from Materials to AI Factories
- John Hu, Director, Advanced Technology Group, NVIDIA
Semiconductor Industry – A Logic Technology Outlook
- Carlos H. Diaz, PhD, Senior Director, TSMC
Reinventing the Transistor for the Quantum Age
- Chetan Nayak, PhD, Technical Fellow, Microsoft
Integrated Material Development Modality Enabling the AI Revolution
- Surésh Rajaraman, PhD, Executive Vice President & Business Unit Head, Thin Films, EMD Electronics
Themed The New Era of Materials Innovation, SMC 2025 will feature the following key sessions:
- Market Geopolitical, and Economic Trends
- Materials in Next Generation Memory Devices
- Next Generation FETs
- Materials Innovation Enabled by AI
- Advanced Packaging, Materials Integration & Challenges
- Orbital Foundries for Next-Generation Semiconductors
- SEMI PFAS Update
- Executive Panel: Impact of US Policy on Semiconductor Industry
Presentations at SMC 2025 will feature insights from the following industry leaders:
- AMD
- Applied Materials
- ASML
- Axiom Space
- Ayar Labs
- Boston Consulting Group
- EMD Electronics
- Entegris
- imec
- Intel Corporation
- Lam Research
- Linx Consulting
- Meta
- Microsoft
- Mitsubishi Chemical Group
- Needham & Company
- NVIDIA
- SEMI
- Techcet
- Terecircuits
- TSMC
The event will feature two exclusive networking sessions, offering attendees the chance to reconnect with industry peers and build new relationships with professionals driving materials innovation.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    