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Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
June 2, 2025 | SEMIEstimated reading time: 1 minute
With materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements. The event will be held on June 23-25, at Hayes Mansion in San Jose, California. Registration is open.
SMC is the industry’s premier event focused on drivers of advanced materials, highlighting key opportunities across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.
SMC 2025 Keynote Presentations
Accelerating AI Computing with Innovations from Materials to AI Factories
- John Hu, Director, Advanced Technology Group, NVIDIA
Semiconductor Industry – A Logic Technology Outlook
- Carlos H. Diaz, PhD, Senior Director, TSMC
Reinventing the Transistor for the Quantum Age
- Chetan Nayak, PhD, Technical Fellow, Microsoft
Integrated Material Development Modality Enabling the AI Revolution
- Surésh Rajaraman, PhD, Executive Vice President & Business Unit Head, Thin Films, EMD Electronics
Themed The New Era of Materials Innovation, SMC 2025 will feature the following key sessions:
- Market Geopolitical, and Economic Trends
- Materials in Next Generation Memory Devices
- Next Generation FETs
- Materials Innovation Enabled by AI
- Advanced Packaging, Materials Integration & Challenges
- Orbital Foundries for Next-Generation Semiconductors
- SEMI PFAS Update
- Executive Panel: Impact of US Policy on Semiconductor Industry
Presentations at SMC 2025 will feature insights from the following industry leaders:
- AMD
- Applied Materials
- ASML
- Axiom Space
- Ayar Labs
- Boston Consulting Group
- EMD Electronics
- Entegris
- imec
- Intel Corporation
- Lam Research
- Linx Consulting
- Meta
- Microsoft
- Mitsubishi Chemical Group
- Needham & Company
- NVIDIA
- SEMI
- Techcet
- Terecircuits
- TSMC
The event will feature two exclusive networking sessions, offering attendees the chance to reconnect with industry peers and build new relationships with professionals driving materials innovation.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.