Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
High Reliability Thanks to Adhesives
April 8, 2015 | Kevin Balben, DELOEstimated reading time: 1 minute
Protecting electronic components from thermal, mechanical and chemical stress is becoming increasingly important in many industries.
While application-friendly packaging is one way to ensure components’ stability, highly reliable encapsulants are playing a more important role as well.
DELO Industrial Adhesives’ product specialist Kevin Balben explains the correct uses of today’s encapsulants and compounds and clarifies the myths that surround them.
True or False?
When using encapsulants and casting compounds in electronic production, there is no alternative to heat curing in ovens.
True. While users have a choice between heat curing and light curing, the latter is used in a handful of applications including those that use connectors, switches and relays. Light curing acrylates are ideal for these applications and enable extremely short cycle times.
As soon as components are exposed to harsh environmental conditions, heat-curing epoxy resins are the only game in town. These robust products contain an anhydride hardener activated by heat. Therefore, curing requires temperatures between +100°C and +180°C.
For demanding conditions there are no alternatives to heat curing. Thermodes and induction are forms of heat curing and work faster than a normal oven, but are still slower than light curing. Users cannot always use induction or thermodes because the geometry and size of the parts may not allow it. For the most part, there is no way around air convection ovens.
Temperature and freedom from tensions are conflicting goals when trying to optimize the curing process.
True. The higher the temperature, the faster the adhesive cures. Thus, high temperatures are good for fast processes. At the same time, high tension causes a great deal of warping since the polymer network is created through heat and shrinks during cooling.
If warping is too intense, the materials should be cured at lower temperatures for a few minutes more. Unfortunately, there is no rule of thumb, so keep in mind that every component and assembly must be assessed individually.
Editor's Note: This article originally appeared in the March issue of SMT Magazine.
Share on:
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.