Multi-core Technology in Safety Critical Applications
June 16, 2015 | KITEstimated reading time: 3 minutes

Information technologies provide cars and planes with many useful assistance systems and determine product properties. In the future, the necessary computation capacity will be supplied by multi-core processors that will replace the inflexible single-core systems with their limited capacity. As a result, however, programming paradigms will change and safety and reliability will have to be rethought and reviewed for critical applications in particular. The ARAMiS project has now developed demonstrators to show how the new technology can be integrated into safety-critical systems.
“We have to pave the way for future innovations in automotive, avionics, and railway technologies that are so important to Germany, and also in industry 4.0,” overall project coordinator Professor Jürgen Becker, KIT, explains. “ARAMiS successfully demonstrates how today’s and future multi-core technologies can and have to be used.”
“We want our products to continue to be the best in the future,” industry coordinator Professor Heinrich Dämbkes, Airbus, adds. “To reach this objective, it is required to transfer latest IT technologies to safe and reliable products for mobility.”
The ARAMiS project has produced five demonstrators based on multi-core technology for use in the automotive, avionic, and railway sectors. In a 1 : 1 –scaled model of an aircraft cabin, several servers for e.g. communication, illumination, and displays are combined in a joint cabin management server and new safety concepts are implemented. In addition, a situation awareness radar system is operated with multi-core processors. In a test vehicle, driver information systems, such as a speedometer, the navigation system or entertainment applications, have been integrated successfully in an electronic multi-core processor device. Multi-core technology is also applied in the area of safety-critical real-time applications, such as chassis and engine control. In the railway technology sector, ARAMiS shows how safety-critical applications can be realized by virtualization on multi-core processors.
In this way, the safety-critical applications can now profit from the higher computation capacity of multi-core systems. In addition, it is possible to reduce weight and the space and energy needed in cars, planes, and trains by replacing many control units by a few high-performance multi-core systems. Apart from safety, efficiency and travel comfort are increased. ARAMiS has produced important technical results for the use of multi-core processors in safety-critical systems. Within the framework of future projects, it is now planned to further develop the methods and concepts for wide application by product developers.
The ARAMiS (Automotive Railway and Avionics Multicore Systems) project had a total volume of about EUR 40 million and a duration of three years. Concepts were developed for use of high-performance computer processors with multiple cores in the transportation sector and for enhancing safety, efficiency, and comfort by new functions. So far, single-core processors have been used for safety-relevant functions only, because their functioning could be predicted with the necessary reliability and, hence, certified. However, single-core processors are presently reaching their limits and increasingly disappear from the market.
The ARAMiS research project was funded by the Federal Ministry of Education and Research (BMBF) and industry at equal ratios. Among the industrial project partners were automotive, railway, and aircraft manufacturers, their suppliers as well as hardware and software producers. In total, 30 companies, universities, and research institutions were involved in the project.
About Karlsruhe Institute of Technology (KIT)
Karlsruhe Institute of Technology (KIT) is a public corporation pursuing the tasks of a state university of Baden-Wuerttemberg and of a national research center of the Helmholtz Association. The KIT mission combines the three core tasks of research, higher education, and innovation. With about 9,400 employees and 24,500 students, KIT is one of the big institutions of research and higher education in natural sciences and engineering in Europe.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.