Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
John Perry Explains IPC T-50 Revision M
June 24, 2015 | IPCEstimated reading time: 1 minute
IPC has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever-evolving standard provides common language of terms and definitions for the electronics industry.
Each year, terms and definitions become relevant in the electronics industry and in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits,delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology.
IPC-T-50M brings more than 150 new and revised terms, while also eliminating out-of-date terminology in order to provide a streamlined standard that focuses on the trending language of the electronics industry. Specifically, this revision includes terms often cited in other standards, such as; conformal coating, statistical process control, and stencil design.
“Our goal is to update the IPC-T-50 standard as often as possible with significant terms and technology. We want to keep the document relevant in today’s rapidly changing industry,” said John Perry, IPC director of printed board standards and technology. “To accomplish this, we solicited input from subject matter experts within the electronic industry who worked on standards, such as the IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, the IPC-6013C, Qualification and Performance Specification for Flexible Printed Boards, the IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings handbook, and the recent IPC-HDBK-850, Guidelines for design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly handbook.”
Stay up to date with the trending terms covering the newest emerging technologies. Learn more about T-50M by clicking here.
Share on:
Suggested Items
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
Hyliion Awarded U.S. Navy Contract to Advance Multi-Unit KARNO Power Module
07/18/2025 | BUSINESS WIREHyliion Holdings Corp., a leading provider of innovative KARNOTM Power Modules, announced it has been awarded a Phase II Small Business Innovation Research (SBIR) contract in the amount of $1.5 million from the U.S. Navy to further develop and refine its scalable multi-megawatt platform for shipboard and stationary military applications.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.