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Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing

05/13/2025 | Barry Matties, I-Connect007
Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meet-ing industry demands and address-ing persistent challenges. One signif-icant innovation is the High Accelera-tion Thermal Shock (HATS²) test sys-tem, which transforms how reliability testing is conducted. After 40 years in the testing busi-ness at Microtek, Bob Neves is begin-ning a new journey with his company, Reliability Assessment Solutions Inc. (RAS). He has been instrumental in developing the HATS² test system, channeling his decades of expertise into what could be considered the perfect machine.

ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities

05/12/2025 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone Circuits, has announced that the company has acquired and installed a state-of-the-art ITC Intercircuit CF 200 high vacuum plugging machine at its West Chicago manufacturing facility. This latest investment further strengthens ASC’s ongoing commitment to advanced manufacturing, precision engineering, and industry-leading process automation.

Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.

Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs

05/01/2025 | Team NCAB -- Column: Fresh PCB Concepts
As a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.

Rising Star Award: Paavo Niskala, TactoTek

04/28/2025 | Nolan Johnson, I-Connect007
Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
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