Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
IWLPC Program Finalized and Registration Now Open
August 13, 2015 | SMTAEstimated reading time: 1 minute
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
The conference, held October 13 and 14, includes three tracks of technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. A strong lineup of plenary speakers and panelists from the world of 3D and MEMS was assembled to provide success stories and offer a glimpse of new and emerging technologies and applications.
Rama Alapati, Director of Package Architecture & Customer Technology (PACT) at GLOBALFOUNDRIES, is scheduled to give the keynote presentation the first day of the conference on “High Density Fan-Out: Evolution or Revolution.”
Sitaram Arkalgud, VP of 3D Technology at Invensas, will deliver the keynote on the second day, titled “2.5D/3D IC - Examining Low Cost Alternatives.”
The exhibition showcasing over 60 solutions providers covering everything from materials to equipment and market research to metrology will run concurrently with the conference on October 13 and 14. Though mostly sold out, a few booths still remain in the exhibition.
On Thursday, October 15, four application-oriented tutorials on Fan-Out Wafer Level Packaging, 3D ICs, Temporary Bonding of Electronics (Wafers, Displays, Devices), and Wafer Level Packaging for MEMS and Microsystems Technologies for Size and Cost Reductions will be instructed by experts in the field including Beth Keser, Ph.D., Qualcomm; John H. Lau, Ph.D., ASM Pacific Technology; Jared Pettit, Alex Brewer, Alman Law, and John Moore, DAETEC; and Leland "Chip" Spangler, Ph.D., Aspen Microsystems, LLC.
Visit http://www.iwlpc.com for more information.
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review, now entering its 18th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.