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i3 Electronics Earns Recertification to AS9100C and ISO 13485:2003
August 14, 2015 | i3 ElectronicsEstimated reading time: Less than a minute
i3 Electronics, Inc. (i3) announced today that it has recently completed assessment for recertification to several critical Quality Management Standards including AS9100C (Aerospace, Military and Defense Standard) and ISO 13485:2003 (Medical Devices).
“i3 Electronics has a strong Quality Management System, and is committed to the on-time delivery of high quality products, that exceed our customer demands. These recertifications are a testament to the dedication of all i3 associates to our Quality System”, stated Dale Kersten, Executive VP and Chief Business Officer at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging; advanced assembly; reliability and signal integrity labs; high speed back plane & press fit assembly; and flexible electronics fabrication & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial, and medical, where highly reliable products built in robust manufacturing operations are critical for success.
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SMT007 Magazine November 2025: Inside Mexico’s Rise as an Electronics Manufacturing Leader
11/03/2025 | I-Connect007 Editorial TeamMexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. In this issue, we uncover why Mexico is earning global recognition. From top-ranked manufacturing capabilities to expanding partnerships that reach far beyond the U.S.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.