Copper Clad Laminate Industry has Entered New Round of GrowthOctober 1, 2015 | PRNewswire
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Copper clad laminate (CCL), a base material for electronics industry and an important raw material for the manufacturing of printed circuit board (PCB), is widely used in electronic products, including TV, radio, computer, and mobile communications.
In 2014, global CCL output witnessed a year-on-year growth of 7.1% to 760 million square meters, of which 520 million square meters were produced in China, accounting for 68.4% of the global total.
Glass-fabric-base CCL and paper-base CCL are two products that have the largest output in China, separately making up 61.4% and 16.5% of China's total CCL output in 2014.
The Chinese CCL market is highly concentrated, with CR5 in CCL industry standing at 68.0% in 2014. Kingboard Chemical ranked first with a market share of 29.3%, followed by Shengyi Technology (14.8%) and ITEQ Corporation (9.3%).
The CCL industry has entered a new round of growth in recent years, and two regions in Asia- China and Southeast Asia have become the fastest-growing ones. Relevant manufacturers have successively taken measures like capacity expansion and acquisitions to strengthen their CCL business.
Shengyi Technology Co., Ltd.: In Aug 2015, the company announced a capital increase of RMB500 million into its holding subsidiary- Shengyi Technology (Suzhou) Co., Ltd to meet the latter's capital demand for building 11 million m2 CCL and 24 million m2 bonding sheet project.
Guangdong Chaohua Technology Co., Ltd.: In Aug 2015, the company acquired a 51% stake in Zhuhai ATEM Electronic Technology Co., Ltd., which specializes in flexible CCL and is one of few domestic adhesive-free flexible CCL manufacturers.
Goldenmax International Technology Ltd.: Phase I of 10.20 million pcs/a medium and high-grade CCL and 6 million m2 prepreg production line project" was completed and went into production in Oct 2014; Phase II was completed and placed in operation in Apr 2015.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.