-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
CIPSA CIRCUITS Installs Orbotech Fusion AOI and Sprint 120 Inkjet Systems
October 15, 2015 | OrbotechEstimated reading time: 1 minute
ORBOTECH LTD announced today that CIPSA CIRCUITS, a European PCB manufacturer and long-time customer of Orbotech, has completed integration of two Orbotech Fusion AOI systems and one Orbotech Sprint 120 inkjet system, purchased in the first half of 2015, for their PCB production facilities in Spain.
CIPSA CIRCUITS selected the Fusion AOI system for its high accuracy and fast setup. With fewer false alarms and outstanding performance on thick copper, the system delivers high throughput.
The Sprint 120 inkjet system offers high throughput and resolution. This system enables consistent printing with full ink coverage in a single pass with precise drop control, it both enhances the company’s competitive edge and reduces operating costs.
“We at CIPSA CIRCUITS were looking for high capacity, high performance AOI and inkjet systems to reinforce our highest quality product standards and to improve speed and flexibility for our fast prototyping market,” explained Mr. Evarist Michavila Subirana, President of CIPSA CIRCUITS. “Based on our long relationship with Orbotech and our excellent experience with their other production solutions, we decided to add three new high capacity, high performance Orbotech systems to our current production site.”
“We are proud that CIPSA CIRCUITS opted for Orbotech systems. These three additional Orbotech systems support CIPSA CIRCUITS business goals including high quality performance, ease of use and low resource consumption”, stated Mr. Hadar Himmelman, President of Orbotech West. “We welcome the opportunity to support our loyal partner with best-in-class solutions.”
About CIPSA CIRCUITS S.A.
Founded in 1982, Cipsa Circuits is a leading European manufacturer of Printed Circuit Boards with production sites in Spain, India and China. The Cipsa Group manufactures PCBs, stencils for SMD assembly, membrane switches, front panels and frames, gaskets for electronics, and customized plastic boxes. For more information, visit www.cipsacircuits.com
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device is produced using Orbotech technology. For more information, visit www.orbotech.com
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.