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Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies

02/29/2024 | IPC
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

X-BATT Unveils Groundbreaking Bio-Derived Composite Anode Materials for Lithium-Ion Batteries

02/27/2024 | BUSINESS WIRE
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.

UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

02/14/2024 | Indium Corporation
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6.

Key Supplier for Mechanical and Optical Processes in the New Teltonika PCB Factory – Schmoll Maschinen GmbH

02/14/2024 | Schmoll Maschinen
Schmoll Maschinen is very happy to become the business partner of Teltonika and to become part of one of the biggest projects in the PCB industry in Europe for the last 5 years.
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