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Indium Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016
January 5, 2016 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, California.
AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Gold-based solder has a high melting point, ranging from 280°C to 1064°C (depending on the alloy), making it compatible with subsequent reflow processes. This alloy has the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation's Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs.
Indium Corporation's precision manufacturing processes and technologies ensure repeatable success in a production process. In addition, Indium Corporation partners with die-bonding equipment manufacturers to ensure that its preforms are engineered to work with equipment from assembly through reflow.
For more information about AuSn preforms, email askus@indium.com, visit www.indium.com/solders/preforms/gold, or stop by Indium Corporation’s booth #311.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
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