American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Raytheon's Development and Testing on Track for DDG 51 Flight III
January 18, 2016 | Raytheon CompanyEstimated reading time: 2 minutes
Raytheon Company announced its AN/SPY-6(V) Air and Missile Defense Radar (AMDR)team has completed the first full radar array, fully populated with component Line Replaceable Units (LRUs), including more than 5,000 Transmit/Receive elements, in 140 days. In less than two years, the radar has been designed, built and transitioned to test; the Engineering and Manufacturing Development (EMD) phase of the program is now more than 66 percent complete. The program remains on track to begin production and deliver on time to the FY16 authorized DDG 51 Flight III destroyer.
"As each milestone is completed, development of the SPY-6 radar progresses on schedule," said U.S. Navy Captain Seiko Okano, major program manager, Above Water Sensors (IWS 2.0). "With this array, now built and operational in the Near Field Range, we're proceeding to plan and commencing full-scale integration and test of AMDR's unprecedented capability."
Subcontractor Major Tool and Machine delivered the array structure to Raytheon's Near Field Range on July 29; and Raytheon installed all passive RF components before September 1. The first Radar Modular Assembly (RMA) was powered up in October and testing began. All RMA chassis were installed by October 16, complete with cooling, power, fiber-optic control and data interfaces. In 79 days the array infrastructure was complete – verification of the simplicity of the AMDR array design. Population of the array with Transmit Receive Integrated Multi-channel Modules and Distributed Receiver/Exciter LRUs completed on December 16.
These recent achievements are among the many successes and milestones realized to date, including:
- Nine of nine major program milestones completed on schedule, including hardware and software Critical Design Reviews and the Development Test Event 2 (DT-2) Readiness Review
- Transition to DT-2 - currently in process, culminating in 2016 with verification of hardware level specifications to requirements and shipment of the array to the Pacific Missile Range Facility in Hawaii for system validation testing (DT-3)
- Completed Build 2 software early, with all planned functionality (30 capabilities), formally qualified in July 2016; Build 3 is more than 75% percent complete
- 95% of EMD hardware production is complete; awaiting final power systems delivery in early 2016
Page 1 of 2
Share on:
Suggested Items
Advantest Forms Strategic Partnerships with FormFactor and Technoprobe
01/09/2025 | AdvantestLeading semiconductor test equipment supplier Advantest Corporation announced that it has entered into small minority investments and partnership agreements with both Technoprobe SpA and FormFactor, Inc.
Revolutionizing PCB Testing: RoBAT's Journey from S1 to SCARA
01/07/2025 | Marcy LaRont, PCB007 MagazineFrom the early days of simple continuity testers to the advanced SCARA machines, RoBAT's evolution in time-domain reflectometer (TDR) and test technology is a testament to the company's commitment to excellence and adaptation in a rapidly changing industry. In this discussion, RoBAT’s Bruce Nockton discusses the journey, challenges, and importance of automating testing solutions, and highlights how RoBAT has become a frontrunner in delivering high-precision testing equipment, setting new standards for the industry.
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered in Durham, North Carolina.
The Test Connection, Inc. Celebrates 45 Years of Excellence in Test Engineering Solutions
01/06/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, proudly marks its 45th anniversary in 2025, celebrating decades of delivering high-quality test engineering solutions to the electronics industry. Founded in 1980 by Bill Horner, TTCI emerged as a pioneer in response to the increasing demand for outsourced test engineering products and services. Since its inception, the company has built a legacy of innovation, technical expertise, and world-class customer service.
The Training Connection LLC Opens Headquarters in Hunt Valley, MD, Offering Premier Technical Training Solutions
01/02/2025 | The Training Connection LLCThe Training Connection LLC (TTC-LLC) is excited to announce the grand opening of its headquarters in Hunt Valley, MD. Founded with the mission to enhance industry knowledge and equip professionals with essential technical skills, TTC-LLC provides top-tier training that enables success for professionals across a variety of industries.