New Technique for Advanced Printed Electronics
March 23, 2016 | AISTEstimated reading time: 5 minutes
For fabrication of organic ferroelectric devices, one of the problems to be solved is to make a homogeneous thin film. The developed printing technique that stimulates thin-film formation from a solution allows formation of highly uniform single-crystalline thin films of organic ferroelectrics. The thin-film device fabricated by the developed technique worked as a memory device with only 3 V which is lower than operation voltage of various memory devices. The developed technique is expected to accelerate the research and development on low power consumption device of printed electronics such as ferroelectric memories and nonvolatile semiconductor FETs.
Details of the results will soon be published online in a German scientific journal, Advanced Materials.
Schematic of fabrication process of single-crystalline thin films of organic ferroelectric molecules
Social Background of Research
Active R&D of the "printed electronics", which applies printing technologies to the production of electronic devices by forming precise, high-quality, metallic and/or semiconducting patterns, has been conducted globally. So far, several printing methods have been enthusiastically developed to fabricate metallic wires and semiconductor layers for transistors, although the development of printing techniques for other types of materials has not been conducted enough. Ferroelectric materials could reduce the power consumption of electronic devices such as ferroelectric memories in IC cards and nonvolatile semiconductor FETs. Therefore, it is required to develop patterning techniques for ferroelectric thin films though printing technologies.
Ferroelectric materials are generally composed of inorganic materials so that it was considered to be difficult to apply a printing process. Although organic ferroelectric polymer materials are applicable to a printing process, their ferroelectric characteristics are inferior to those of inorganic materials. In recent years, research and development of organic ferroelectrics composed of small molecules have advanced. Some new organic materials showing superior characteristics comparable to inorganic ones have been found. Though thin-film formation of these materials is indispensable for making them into devices, it is difficult to form thin films of the materials. Therefore, it was desired to develop a fabrication technique of uniform thin film without any pinholes through a printing process.
Page 1 of 3
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.