NASA Investigates 3-D Printing for Building Densely Populated Electronic Assemblies
April 26, 2016 | NASAEstimated reading time: 2 minutes
As detector assemblies get smaller and denser — packed with electronic components that all must be electrically connected to sense and read out signals — it’s becoming increasingly more challenging to design and manufacture these all-important instrument devices.
A team of NASA technologists at the Goddard Space Flight Center in Greenbelt, Maryland, however, has begun investigating the use of a technique called aerosol jet printing or direct-write manufacturing to produce new detector assemblies that are not possible with traditional assembly processes.
“If we succeed, aerosol jet technology could define a whole new way to create dense electronic board assemblies and potentially improve the performance and consistency of electronic assemblies,” explained Goddard technologist Beth Paquette, who is leading the R&D effort that began last fiscal year. Furthermore, aerosol jet printing promises to slash the time it takes to manufacture circuit boards, from a month to a day or two, she added.
Important Distinction
As with other 3-D printing techniques, aerosol jet manufacturing builds components by depositing materials layer-by-layer following a computer-aided design, or CAD, drawing. However, jet aerosol printing offers an important difference.
Instead of melting and fusing plastic powder or some other material in precise locations, as in the case of many 3-D printers, aerosol jet printing uses a carrier gas and printer heads to deposit a fine aerosol of metal particles, including silver, gold, platinum, or aluminum, onto a surface. Aerosol jet printers also can deposit polymers or other insulators and can even print carbon nanotubes, cylindrically shaped carbon molecules that have novel properties useful in nanotechnology, electronics, and optics.
“It can print around bends, on spheres or on something flat, or on a flexible surface, which then can be flexed into the shape you want,” she said.
These attributes make the technology ideal for detector assemblies, particularly those that need to be shaped differently or are very small, yet dense because of the large number of tiny components that must be electrically wired or linked together on a circuit board — an inescapable reality as instruments get smaller and smaller.
“We can make these wires microns in width,” Paquette said. “These lines are very small, down to 10 microns wide. These sizes aren’t possible using traditional circuit board manufacturing processes.” (By way of comparison, the average human hair measures between 17 and 191 microns in width.)
Page 1 of 2
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Long Night of Research 2026: AT&S Brings Artificial Intelligence to Life
04/15/2026 | AT&SWhen the Long Night of Research takes place throughout Austria on Friday, April 24, setting an example for the country’s innovative strength, AT&S will be there with a special highlight.
Foxconn Recognized as Top 100 Global Innovators 2026
04/14/2026 | FoxconnHon Hai Technology Group (Foxconn) has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.
RTX's Raytheon Unveils First Event-Based MWIR Camera for Real-Time High-Speed Threat Tracking
04/13/2026 | PRNewswireRaytheon, an RTX business, successfully demonstrated a new event-based mid-wave infrared (MWIR) camera that tracks high speed objects in real time while dramatically reducing processing and power demands.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
Gartner Forecasts Worldwide Semiconductor Revenue to Exceed $1.3 Trillion in 2026
04/10/2026 | Gartner, Inc.Global semiconductor revenue is projected to exceed $1.3 trillion in 2026, exhibiting the highest growth in the last two decades, according to Gartner, Inc., a business and technology insights company.