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Technica USA to Distribute Symtek Automation Asia Co., Ltd’s Automation Systems and Technology

09/28/2023 | Technica USA
Technica USA announced it has reached a Master Distribution Agreement with SAA to promote and support automation systems & technology offered by SAA.

Lockheed Martin Conducts First Flight In U-2 Avionics Tech Refresh

09/26/2023 | Lockheed Martin
Lockheed Martin Skunk Works, in partnership with the U.S. Air Force, completed the first flight of the U-2 Dragon Lady's Avionics Tech Refresh (ATR) program.

Macronix OctaFlash Memory Solutions Certified for ISO 26262 ASIL D

09/26/2023 | PRNewswire
Macronix International Co., Ltd., a leading integrated-device manufacturer in the non-volatile memory (NVM) market, announced its OctaFlash memory line has received ISO 26262 ASIL D (Automotive Safety Integrity Level) certification from SGS TÜV Saar, ensuring makers of automotive electronic systems that OctaFlash meets the highest level of safety in automotive electronics.

Towards a Silicon to Systems Industrial Strategy

09/25/2023 | Alison James
"Electronics systems are at the heart of almost all modern technology. The performance and functionality of these systems have increased at breathtaking speed, chiefly as a result of advancements in semiconductor technology. Semiconductors do not function in isolation," writes Alison James, IPC senior director of government relations, in a 2023 report for the European Commission’s Directorate General for Internal Market, Industry, Entrepreneurship. "These electronics systems feature prominently in key sectors like defence, aerospace, space, automotive, medical, and high-performance computing, but electronics are vital to every industry and are central to a variety of EU priorities, including the twin digital and green transitions and Europe’s technological sovereignty."

Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4

09/28/2023 | Michael Carano -- Column: Trouble in Your Tank
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
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