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Last Call to Register for 2016 Environmental Compliance Conference
June 1, 2016 | IPCEstimated reading time: 1 minute
It's a continuing challenge to stay current on global environmental regulations and issues such as EU RoHS exemption requests, China RoHS, EU REACH and the EU Circular Economy Strategy.
That is why IPC and ITI are again joining forces to help keep you ahead of the curve with the 2016 Conference on Emerging & Critical Environmental Product Regulations. This year's conference is your opportunity to hear expert insights on the recent EU Court of Justice decision on the definition of "article" and its impact on EU REACH, new developments for the EU RoHS exemption requests, and the recast and use changes to China RoHS.
The conference will feature compelling keynote presentations from well-known United Kingdom (UK) regulators Steve Andrews, of the UK Department for Environment, Food & Rural Affairs; and Dave Symons, of the Department for Business, Innovation & Skills and the Department for Energy and Climate Change.
An expert panel of electronic supply chain members and professionals will also discuss alternatives assessment — including the positive or negative impacts of substituting materials in products — and how to manage materials deselection based on assessments. Panelists include, by location:
- Boston: Pam Eliason, TURI; Martha Coopersmith Gray, Ampehnol TCS; Stephen Greene, EMC Corporation
- Chicago: Dr. John Howarter, Purdue University; Haim Eliyahu, Molex Inc.; Bill Olson, Seagate Technology
- Silicon Valley: Corrine Holmes, Microsoft Corporation; John Katz, EPA Region 9; Neil Smith, Isola Group SARL
This conference will provide anyone who is responsible for keeping their organization in compliance with environmental regulations the tools they need to comply with legal, regulatory, and customer requirements.
For more information, click here.
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Sweeney Ng - CEE PCBSuggested Items
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    