Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
Standard of Excellence: Building Trust with Customers—The Foundation of Excellent Service
BTU Continues Advanced Research in Electronics Assembly
June 14, 2016 | BTU International, Inc.Estimated reading time: 2 minutes
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL). The state-of-the-art APL currently houses a PYRAMAX 100N Reflow Oven with 400°C capability and will soon accept delivery of a PYRAMAX™ 125N Reflow Oven. The 125N features a 24" width process chamber enabling the processing of large boards for LED and other applications.
“Our involvement in the APL has multiplied our capabilities in advanced SMT processes,” said Rob DiMatteo, Regional Sales Manager for BTU. “There are a number of process challenges and opportunities today in both SMT and packaging; we aim to be part of the solution,” added DiMatteo.
More than twenty years ago, Universal Instruments’ SMT Laboratory initiated a pre-competitive cooperative research effort with various Fortune 100 companies for the comprehensive development of the assembly processes for Ultra Fine Pitch and Tape Automated Bonded components. The project was organized to defray the high costs and associated technical risks among a large group of principals and to allow the researchers from the member companies an opportunity to cooperate in research projects. This highly successful research collaboration has evolved and adapted to the ever-changing demands of the electronic packaging and assembly industry. It developed into a series of funded research projects now known as the AREA Consortium.
The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe.
About Universal
Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, New York, with offices in Europe, Asia, and the Americas.
Share on:
Suggested Items
Teledyne Completes Acquisition of Select Aerospace and Defense Electronics Businesses of Excelitas
02/05/2025 | BUSINESS WIRETeledyne Technologies Incorporated announced today the successful completion of the acquisition of select aerospace and defense electronics businesses from Excelitas Technologies Corp. (“Excelitas”) for approximately $710 million. The acquisition includes the optical systems business known under the Qioptiq® brand based in Northern Wales, UK, as well as the U.S.-based advanced electronic systems business.
Flexible Thinking: Mind-tapping into January
02/05/2025 | Joe Fjelstad -- Column: Flexible ThinkingIt’s January again, and our beleaguered planet has completed yet another trip around the sun. The Romans named January in honor of their god Janus, who is usually depicted as a bearded old man with two faces—one looking back to the past and the other looking forward to the future. People venerated Janus as the god of beginnings and endings, transitions, and the passage of time. With that in mind, I’ll look 10 years into the future—hopefully with a bit of inspiration from Janus—and prognosticate what might be happening in electronic design.
INEMI Launches Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap
02/05/2025 | iNEMIJoin us for an insightful webinar as INEMI kicks off the development of additional content for the Sustainable Electronics Roadmap, focusing on ecological footprint minimization.
Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award
02/05/2025 | Nordson CorporationNordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.