-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Sensible Design: Coatings—Five Essentials for Designers
June 28, 2016 | Phil Kinner, ElectrolubeEstimated reading time: 2 minutes

As I sit down to write my fourth column on the subject of conformal coatings, I’m reminded—as we in the UK continue to experience almost sub-arctic weather conditions this Spring, including snow in April—that it is always best policy to be prepared for those unexpected environmental elements. And where electronic circuit board protection is concerned, that means being prepared for all eventualities. So, as the central heating is fired up a notch or two and the barbecue stove is wheeled back into the garage, let’s consider what we’ve covered so far on the subject of conformal coatings.
True to form, I’ll be providing five PCB design pointers each month to help you avoid some common pitfalls when applying conformal coatings. We have so far looked at tricky production related issues that could so easily have been resolved at that all-important design stage, examined some of the more common dos and don’ts; those are issues that come up time and time again, despite meticulous attention to design detail, and which must be taken into consideration when coatings are finally applied. We’ve explored the implications of housing design on conformal coating performance, particularly the influence that fixtures and fittings can have in terms of thermal shock loading and the adverse effects of forced air cooling when abrasive particles are present. So, let’s cover how the physical shape of board components and the interaction with solder paste, solder masks and fluxes can affect conformal coating integrity.
The focus for this month will be my absolute essential facts—my “Never leave home without them” list, so to speak!
Fact 1: In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. A really neat way of determining this weak point is to use stress tests such as powered condensation tests. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.
Once the design is optimised for corrosion resistance, the conformal coating will often be even more effective in ensuring corrosion free operation. Stress tests (thermal shock, for example) are not intended to be used on final assemblies for product validation. Failure mechanisms may well be different, and may be missed by stress tests. Product validation testing should mimic end use environments as closely as possible. (Here at Electrolube, our testing is designed to push products even further than in actual usage scenarios.)
To read this entire article, which appeared in the May 2016 issue of The PCB Design Magazine, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.