Marcy’s Musings: Operating Without a Rulebook
It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
UVA Teaches PCB Design With NI AWR Tools
August 2, 2016 | NIEstimated reading time: Less than a minute
The University of Virginia (UVA) Engineering School, the third oldest public university engineering school in the United States, is dedicated to providing significant hands-on experiences in RF and microwave circuit design to its students. The RF and Wireless Circuits course, taught by Prof. N. Scott Barker, covers design basics such as device impedance matching, noise, distortion and RF building blocks (low-noise amplifiers, mixers, voltage-controlled oscillators). The classroom learning material is complemented by a semester-long project of designing, building, testing and fielding a weather satellite receiver to receive and demodulate an automatic picture transmission (APT) signal.
“Using NI AWR software in my RF and microwave classes and labs has given my students strong hands-on experience, as well as a better view of how and why components interact as they do,” said Scott Barker, professor at UVA. “Since adopting NI AWR Design Environment, the size of my course has tripled to over 30 students.”
For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.