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Stringent High-speed Requirements Pose Technology Challenges

10/03/2024 | Tarja Rapala and Joe Beers, iNEMI
The ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.

TRI Releases Core Features 3D AOI Solution

09/23/2024 | TRI
Test Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.

Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test  

09/19/2024 | atg Luther & Maelzer GmbH
atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.

Transtec and YAMAHA Motor Robotics to Showcase Latest Technology at SMTAI 2024

09/18/2024 | Yamaha Motor Robotics Holdings Co., Ltd.
Trans-Tec America, in Partnership with Yamaha Robotics USA, will exhibit dynamic SMT assembly technologies at the SMTAI 2024 trade show and conference, October 20 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.

Circuit Technology Center Announces Expanded Tinning Services Capacity

09/16/2024 | Circuit Technology Center
Circuit Technology Center announces it has expanded its electronic component tinning services capacity.  Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
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