-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
ECWC14 Seeking Abstracts for 14th Electronic Circuits World Convention
September 30, 2016 | IPCEstimated reading time: Less than a minute
The 14th Electronic Circuits World Convention (ECWC14) will be held in KINTEX, Goyang City, South Korea from April 25 to April 27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) and the World Electronic Circuits Council (WECC). This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.
In line with this, the ECWC14 is inviting submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:
Management
- Market Trends and Outlook
- Supply Chain Management (SCM)
- Standard, Certification and Qualifications
- Environment, Health and Safety (EHS)
- Business Strategy
Technology
- Materials and Components
- Design and Data Transfer
- Test and Reliability
- Processes, Chemical and Physical
- HDI / Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit
- Application Specific Circuits
- Packaging/Substrate Technology
- SMT and Assembly
- Emerging Technologies
The abstract submission deadline is September 30, 2016. For more information, please contact Dr. Tim Lee, ECWC 14 Secretariat.
Suggested Items
AIM Solder Appoints Kevin Kwan as Business Development Manager in Asia
09/06/2024 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Kevin Kwan as Business Development Manager for the Asian market.
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends
09/06/2024 | SEMISEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR.
MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics
09/05/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor.
Altus Enhances Customer Support in the North
09/05/2024 | Altus GroupAltus Group, a leading capital equipment distributor for the electronics industry in the UK and Ireland, is pleased to announce the addition of a Senior Sales Manager to its growing team.
Altium, Mouser Team Up to Advance Electronics Education and Careers Worldwide
09/05/2024 | AltiumAltium LLC, a global leader in software and solutions for the electronics industry, and Mouser Electronics, a global authorized distributor of semiconductors and electronic components, are excited to announce a strategic partnership aimed at advancing electronics education and careers worldwide.