Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
ECWC14 Seeking Abstracts for 14th Electronic Circuits World Convention
September 30, 2016 | IPCEstimated reading time: Less than a minute
The 14th Electronic Circuits World Convention (ECWC14) will be held in KINTEX, Goyang City, South Korea from April 25 to April 27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) and the World Electronic Circuits Council (WECC). This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.
In line with this, the ECWC14 is inviting submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:
Management
- Market Trends and Outlook
- Supply Chain Management (SCM)
- Standard, Certification and Qualifications
- Environment, Health and Safety (EHS)
- Business Strategy
Technology
- Materials and Components
- Design and Data Transfer
- Test and Reliability
- Processes, Chemical and Physical
- HDI / Fine Circuit Fabrication, Processes and Equipment
- Flexible Circuit
- Application Specific Circuits
- Packaging/Substrate Technology
- SMT and Assembly
- Emerging Technologies
The abstract submission deadline is September 30, 2016. For more information, please contact Dr. Tim Lee, ECWC 14 Secretariat.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.