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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Beyond the Board
Column from: Jesse Vaughan
A third-generation Printed Circuit Board (PCB) technologist, Jesse brings a deep-rooted passion and expertise in PCB design, fabrication, assembly and program management. With years of hands-on experience across the entire PCB lifecycle, he has worked closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. From optimizing complex board designs to streamlining production processes, Jesse excels at bridging the gap between innovation and manufacturability. Committed to advancing PCB technology, he leverages a legacy of industry knowledge as an active member for several IPC committees.