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SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game

04/13/2026 | Marcy LaRont, I-Connect007
It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.

PCBAA Sets Its Priorities for 2026: Support in the House and Senate

02/03/2026 | Marcy LaRont, I-Connect007
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.

SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1

10/07/2025 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
Data is one of the six pillars of AI infrastructure. It is critical to the performance of artificial intelligence (AI) models. AI data, essential to both the training and inference of Generative AI models, connotes the datasets used to train, validate, and test AI models. Training data provides models with a frame of reference by establishing a baseline against which models can compare new data using pre-trained models for predictions or generating new content.

U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say

08/18/2025 | I-Connect007 Editorial Team
Two sources told Reuters that U.S. authorities have secretly placed location trackers in some advanced chip shipments they see as at high risk of illegal diversion to China. They said the trackers are intended to locate AI chips that are sent to locations restricted by U.S. export laws, but authorities only examine some shipments.

Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
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