-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
HKPCA’s Daniel Chan on China’s PCB Manufacturing and Technology Landscape
November 18, 2016 | Edy Yu, I-Connect007Estimated reading time: 1 minute
Editor Edy Yu recently spoke with Daniel Chan, executive director of the Hong Kong Printed Circuit Association (HKPCA). Chan possesses more than 25 years of experience in global business management with strong leadership influencing suppliers and internal clients in business strategy and transformation. Prior to HKPCA, Chan had worked in IBM as the Global PCB Commodity Chairman, in the area of integrated supply chain management, quality assurance management, manufacturing and process engineering development and integrated product development. In this interview, Chan discusses the highlights of this year’s International Printed Circuit and APEX South China Fair 2016, and he provides his insights on the current PCB technology and manufacturing landscape in China.
Edy Yu: What should we expect this year at the HKPCA & IPC Show?
Daniel Chan: The HKPCA & IPC Show is one of the most influential trade shows in the PCB and electronics assembly markets. It provides the industry with a premium platform for technology exchange as well as leading industry development.
This year’s show theme is “Global Wisdom Shaping the Future,” and is expected to attract close to 550 exhibitors from 17 countries and regions showcasing their latest innovations in more than 2,500 booths at Halls 1, 2 and 4 of the Shenzhen Convention and Exhibition Center. Our exhibition area now covers more than 50,000 square meters. Of the 550 exhibitors, 100 of them are new to the show.
We are also launching a new Japan/Korea Pavilion this year in Halls 1 and 2. This will group together the leading industry players from Japan and South Korea, bringing innovative equipment and technologies from these two countries to the show. As of September, it had attracted close to 30 exhibitors from Japan and South Korea, including JCU, Tsunoda, Taiyo Ink, Uyemura, Leadtech, Ishihara, NR G&C, MEC, Taesung, and GCE.
This year, the Smart Automation Pavilion will feature enriched content to help the industry progress towards higher productivity and more intelligent production. We are also bringing the Hand-Soldering Competition World Championship to the show, which will be its first time in China. Champions from China, Germany, the United States, South Korea and Japan will compete for the world title. Visitors will be able to observe the highest levels of hand-soldering craftsmanship at the event.
To read the full version of this article which appeared in the November 2016 issue of The PCB Magazine, click here.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.