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Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona

11/15/2024 | U.S. Chamber of Commerce
TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process

11/08/2024 | Michelle Te, IPC Community
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.

The Cost-Benefit Analysis of Direct Metallization

10/21/2024 | Carmichael Gugliotti, MacDermid Alpha
Carmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration

10/11/2024 | PRNewswire
Iridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.
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