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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Real Time with… IPC APEX EXPO 2024: Direct Imaging Equipment and Quad-wave DLP Light Engine Technology
May 3, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Guest Editor Kelly Dack and MivaTek's Brendan Hogan delve into the company's innovative technologies, including direct imaging equipment and quad-wave DLP light engine technology. They highlight the benefits of direct imaging, compensation, and DART technology. The conversation also touches on strategies for enhancing registration and feature size, their global market presence, and their focus on EV battery fabrication.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona
11/15/2024 | U.S. Chamber of CommerceTSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
11/08/2024 | Michelle Te, IPC CommunityPCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration
10/11/2024 | PRNewswireIridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.