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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
December 14, 2016 | Real Time With... HKPCA & IPC Show 2016Estimated reading time: Less than a minute

At the recent HKPCA and IPC Show 2016 in Shenzhen, China, Shavi Spinzi, director of industry marketing, PCB Division, at Orbotech, speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers.
He explains why the PCB manufacturing industry needs to move to Industry 4.0, and talks about how Orbotech can help them in their Industry 4.0 journey.
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