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Ventec’s Martin Cotton to Showcase Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
January 10, 2017 | Ventec International GroupEstimated reading time: 1 minute

Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is participating at the 2017 DesignCon show in Santa Clara, California, USA from 31st January to 2nd February as both an exhibitor on booth #118 and technical presenter. The presentation will unveil the industry's most advanced ultra-low Dk PCB materials for high-speed low-loss applications.
Ventec will be participating at DesignCon 2017, the premier conference for chip, board, and systems design engineers, on booth #118 and has specifically chosen the event as the ideal platform to unveil the industry's latest advances in PCB materials for high-speed low-loss applications. Ventec's Martin Cotton (Director - OEM Technology Marketing) and Bill Wang (Technical Director) will be presenting their paper titled "Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications" in Ballroom F on Wednesday, 1st February at 8:00am.
The technical presentation will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8.
"By lowering the material Dk to ultra-low levels using FR4 processes, the delicate balance of performance and cost is achieved", said Martin Cotton. "Higher layer counts on backplanes, daughter cards and hand-held's are achieved in a smaller footprint by having smaller layer to layer separation without sacrificing trace width. Having potentially wider traces produces lower resistance in the signal path" he continues. "Combining ultra-low Dk with a low Df of 0.002 to 0.004, produces an alternative to ever smaller traces and higher power requirements."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
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Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
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Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.